· 3D process and integration technology

· Substrate embedding and advanced flip chip packaging

· MEMS and sensor technology

· Design and Analysis of Transmission System

· New materials, equipment and 3D interconnection

· Wearable, flexible and stretchable electronics

· Optical interconnection and 3D photonics

· Digital system and logic design

· Computer architecture and VLSI

· Network-driven multi-core chip

· Advanced robotic system

· Analog and digital electronics

· Signals and Systems

· Electronic equipment

· Satellite and Space Communications

· Network and Information Security

· Signal processing for wireless communication

· Cognitive Radio and Software Radio

· Optical networks and systems

· Electromagnetic field theory

· Antenna, propagation and transmission technology

· Optical communication

· Radar signal and data processing

· Other related topics