The 6th International Conference on Electronic Engineering and Informatics (EEI 2024) Concluded Successfully!
From June 28 to 30, the 6th International Conference on Electronic Engineering and Informatics (EEI 2024) concluded successfully in Chongqing. The conference was technically supported by IEEE SMC and hosted by Southwest University. It was jointly organized by the School of Electronic Information Engineering at Southwest University, the Chongqing Research Institute of Hunan University, and the School of Electronic Information Engineering at Yangtze Normal University, with co-organization from Kaili University, Guizhou Minzu University, Chongqing Three Gorges University, Chongqing University of Education, Xiamen University, and AEIC Academic Exchange Center. iScholar provided comprehensive publishing and service support for this conference.
On the eve of the conference, Vice President Zhou Guangming of Southwest University represented the university in meeting with Academician Chai Tianyou and other experts and scholars, engaging in friendly exchanges.
This three-day academic event gathered over 120 outstanding scholars, including academicians and distinguished young scholars, from both home and abroad. It attracted more than 600 participants hailing from over 180 renowned universities, including Tsinghua University, Peking University, Nankai University, Shanghai Jiao Tong University, Tongji University, Huazhong University of Science and Technology, and Chongqing University.
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At the opening ceremony, Professor Hongyi Li, Dean of the School of Electronic Information Engineering at Southwest University and Chair of the conference, served as the host. Professor Xia Yufeng, Deputy Party Secretary and Secretary of the Discipline Inspection Commission of Southwest University, delivered an enthusiastic opening address.
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During the keynote session, we had the honor of inviting seven leading experts in the field: Professor Chai Tianyou, Academician of the Chinese Academy of Engineering from Northeastern University; Professor Qiao Junfei, Vice President of Beijing University of Technology; Professor Gao Xinbo, President of Chongqing University of Posts and Telecommunications; Professor Hu Bin from Lanzhou University; Professor Zeng Zhigang from Huazhong University of Science and Technology; Professor Guo Guoxiang from Louisiana State University in the United States; and Professor H.K. Lam from King's College London in the United Kingdom.
Prof. Tianyou Chai, Northeastern University, China Academician of the Chinese Academy of Engineering, IEEE Life Fellow Title: Intelligent Decision and Control Integrating System Based on End-edge-cloud Collaboration |
Prof. Bin Hu, Lanzhou University, China Title: Computational Psychophysiology Based Emotion Analysis for Mental Health |
Prof. Zhigang Zeng Huazhong University of Science and Technology, China Title: Research on Autonomous Intelligent System Based on Associative Memory |
Prof. Junfei Qiao Beijing University Of Technology, China Title: Digital-Intelligent Integrated Optimization Control of Solid Waste Incineration Processes |
Prof. Xinbo Gao Chongqing University of Posts and Telecommunications, China Title: Brain Inspired Trustworthy Visual Intelligence |
Prof. Guoxiang Gu School of EECS, Louisiana State University, USA Title: A Conformal Mapping and Interpolation Approach to the Delay Margin Problem |
Prof. H.K. Lam, King's College London, UK Title: An Overview of Interval Type-2 (IT2) Fuzzy Model Based Control |
Additionally, five awards were established to recognize outstanding scholars for their remarkable contributions during the conference. These awards include the Best Oral Presentation Award, Best Poster Nomination Award, Best Poster Award, Best Paper Nomination Award, and Best Paper Award.
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With this, the 6th International Conference on Electronic Engineering and Informatics (EEI 2024) has successfully concluded. This conference not only provided a platform for sharing the latest research findings and development trends but also laid a solid foundation for future scientific cooperation, project collaborations, and talent exchange. Through this international academic event, we have established a broader network for academic exchange and collaboration, thereby promoting further advancements in the field of electronic engineering and informatics. Finally, let us look forward to reconvening next year to jointly explore new frontiers in technology, contributing our wisdom and strength to the prosperous development of this field!
