2024 6th International Conference on Electronic Engineering and Informatics (EEI 2024)

About to EEI 2024

2024 6th International Conference on Electronic Engineering and Informatics


2024 6th International Conference on Electronic Engineering and Informatics (EEI 2024) will be held in Nanjing, China from June 28 to 30, 2024.

EEI 2024 is to bring together innovative academics and industrial experts in the field of  Electronic Engineering and Informatics to a common forum. The primary goal of the conference is to promote research and developmental activities in  Electronic Engineering and Informatics, and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in  Electronic Engineering and Informatics and related areas.

We warmly invite you to participate in EEI 2024 and look forward to seeing you in Nanjing!

摄图网_501299705_破晓时分的金陵城(企业商用).jpg

Publication

All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus  for indexing.

EEI 2022: CoverEI CompendexScopus

EEI 2021: CoverEI CompendexScopus

EEI 2020: CoverEI CompendexScopus

EEI 2019: CoverEI CompendexScopus

Note: All submitted articles should report original results, experimental or theoretical, not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academic. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

CALL FOR PAPERS

hot.gif The topics of interest include, but are not limited to:

Electronic Technology

3D process and integration technology

Substrate embedding and advanced flip chip packaging

MEMS and sensor technology

Design and Analysis of Transmission System

New materials, equipment and 3D interconnection

Wearable, flexible and stretchable electronics

Optical interconnection and 3D photonics

Digital system and logic design

Computer architecture and VLSI

Network-driven multi-core chip

Advanced robotic system

Analog and digital electronics

Signals and Systems


Information and Communication

Electronic equipment

Satellite and Space Communications

Network and Information Security

Signal processing for wireless communication

Cognitive Radio and Software Radio

Optical networks and systems

Electromagnetic field theory

Antenna, propagation and transmission technology

Optical communication

Radar signal and data processing

Other related topic

For more information, please click:

Learn More

SUBMISSION

news.gif Please send the full paper(word+pdf) to Submission System : 

Submission System (Chinese Authors) (Pay for RMB)

Submission System (Foreign Authors) (Pay for USD)

news.gif Templates:Download

For more information, please click: 

Learn More

IMPORTANT DATES

Full Paper Submission Date

Registration Deadline

Final Paper Submission Date

Conference Dates

March 28, 2024

June 17, 2024

June 24, 2024

June 28-30, 2024

If you have any question or inquiries, please feel free to contact us.Contact